Heat sinks(Metal-backed PCB)

Production since 2003

Hybrid or Teflon PCB’s

Bonded to thick Copper pallets ( 1mm – 5mm)

Large WPNL size

Experience with Pre-bonded, Post-bonded, Press fit, embedded and various coin designs

Coin assembly by Bonding film, PSA , Embedded coin & Press fit

Special team to support NPI and production

Special team to support NPI and production

Used in Power amplifiers or RF modules

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